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What equipment is needed for chip testing? What test method is used?
In recent years, the demand of semiconductor equipment market in Chinese Mainland has grown rapidly. In this context, the high-precision detection equipment that must be used for chip wafer detection also has an increasingly broad market.
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Some characteristics and challenges of high-end performance packaging technology
High performance computing, artificial intelligence and other applications are driving the technological nodes of chips forward, leading to prominent difficulties and cost issues in design and manufacturing. In response to this problem, Chiplet technology has emerged.
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Technical characteristics of MLCC in chip package
The chip was originally composed of wafers to form different circuits, with the miniaturization of the chip and the development of multi-function integration, a single chip carries many complex functions, and many peripheral circuits and devices are integrated into a single chip.
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The surge in semiconductors is not just due to artificial intelligence
Recently, the chip semiconductor sector has risen sharply, and some people think that it is stained with the light of artificial intelligence, but it is not. The sharp rise in the semiconductor sector is because the industry cycle turning point is approaching, and the inventory leading indicator has begun to fall.
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Advanced packaging substrate technology
IC packaging substrate is an important component of semiconductor packaging material, used to carry the chip, provide electrical connection, protection, support and heat dissipation for the chip. In order to achieve the system-level integration requirements of 3D-SiP, to meet the needs of high-end applications such as 5G and high-performance computers in the future
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This article explains: The difference between EMC bracket and PCT bracket in LED
At present, the LED packaging bracket is mainly composed of plastic, copper, electroplating, of which the key to heat conduction is to look at the material of the plastic
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Details of chip package types: 7 mainstream packages and their derivative packages
Chip package type details: 7 mainstream package and its derivative package chip in the final analysis, the core is the wafer, but the actual finished chip is another form, this process from the wafer to the finished chip, we call chip package.
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An article that explains the advantages and disadvantages of advanced packaging for Chiplets
One article explains the advantages and disadvantages of advanced packaging for Chiplets. One core conclusion is that advanced processes are limited, and there must be a trade-off between advanced packaging and Chiplets to improve computing power. Under the premise of technology availability, improving chip performance is the first choice for advanced process upgrades, while advanced packaging adds to the icing on the cake.
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