This article explains: The difference between EMC bracket and PCT bracket in LED

At present, the LED packaging bracket is mainly composed of plastic, copper, electroplating, of which the key to heat conduction is to look at the material of plastic, the main application materials are PPA, PCT, EMC.

Tektronix LED packaging stand

1, the main materials are different

The main material of EMC bracket in LED is epoxy resin, which belongs to thermosetting material and is mainly raw material; The PCT bracket is a thermoplastic material, containing water inlet material, which is a high-temperature resistant, semi-crystalline thermoplastic.

2. Different liquidity

The fluidity of PCT is slightly poor, and it can only be extruded, which is more brittle; EMC, strong mobility, MAP packaging, higher efficiency, its air tightness, high temperature aging resistance, UV attenuation resistance.

3, high temperature resistance is different

Its high temperature resistance, UV resistance performance difference is large, PCT can do 0.8W, and EMC can do 3W, EMC bracket with high heat resistance, UV resistance, high current, small size, anti-yellows characteristics, for the pursuit of the cost of the LED seal factory to bring a new choice.  PCT brackets are generally used for small and medium power LED packages, usually no more than 1W. The EMC bracket has pinch and bottom test, square cup and round cup, small cup and equal cup, can do monochrome and RGB and RGBW. Commonly used models are: 2835, 3030, 5050, 7070, 7020, 4014, 3014, etc., the width is: 60mm, 75mm, etc., the mouth of the cup is 2.1mm, 2.6mm, 2.4mm, 1.8mm, and the thickness is 0.55mm and 0.6mm.

PCT materials can be used for large-scale outdoor LED screen production, which can achieve good environmental adaptability. In addition, the PCT material is added with ceramic fiber, containing about 20% fiber, good weather resistance, UV resistance, low water absorption and molding shrinkage, and good dimensional stability.

More than 90% of the plastic packaging (referred to as plastic sealing) material uses EMC, and the plastic sealing process is to use the transfer forming method to extrude EMC into the mold cavity and bury the semiconductor chip in it, and at the same time cross-linked curing molding, becoming a semiconductor device with a certain structural appearance.