Technical characteristics of MLCC in chip package

The chip was originally composed of wafers to form different circuits, with the miniaturization of the chip and the development of multi-function integration, a single chip carries many complex functions, and many peripheral circuits and devices are integrated into a single chip. Compared with the conventional scene on the PCB board, the chip space is small, the temperature is high, and the stability requirements are high, which is also higher for the embedded components.

The upgrade of chip intelligence has led to the extension of MLCC from PCB to the inside of the chip package. Integrated modules and chips develop rapidly, the process is extremely precise, SIP packaging, computing power continues to improve, and the MLCC used accordingly requires ultra-micro, low loss, high capacity, high temperature resistance and other characteristics.

"Ultra-micro" is the main feature of the in-chip packaging MLCC, 01005/008004 size MLCC, ultra-small size, ultra-thin height characteristics, very suitable for the scene of small space in the chip. Compared with the MLCC used in a large number of consumer electronics products, the degree of miniaturization in the chip is 1-2 generations ahead of time, such as the largest use of 0201 size MLCC on the market, flagship smartphones, high-precision modules and smart wearable products began to drive the use of 01005 size MLCC, but in the chip, the mainstream is already 01005. The MLCC size 008004 has been widely used in advanced products.

High temperature MLCC is mainly for the capacity of such C0G and X7R materials of 100nF and above that is difficult to reach in small sizes, and raises its temperature from 85 ° C of X5R to 105 ° C or 125 ° C to improve its stability and reliability in high temperature environment.

Rf chip is an important class of chips, the RF performance requirements of supporting components are very high, the demand for MLCC gradually tends to ultra-micro, high-precision, high-Q products. At present, 2G mobile phones with RF and microwave chips have adopted a large number of CMOS technology, and the 3G/4G/5G standard is still dominated by GaAs. However, with the increase of package density, the internal size specification of MLCC in RF PA modules has fully transited from 0201 size to 01005 size. Among them, the key functional characteristics of RF PA are mainly RF MLCC used for RF link impedance matching.

Rf MLCC through the design and improvement of the internal structure of the components, microwave ceramic dielectric materials, and low-loss copper electrode materials, to achieve low ESR, strong anti-interference, high SRF and other characteristics of MLCC, the processing effect of RF signal processing is very ideal.

Inverted MLCC is to invert the length and width of the MLCC, shorten the inner electrode, increase the number of layers of the electrode, thereby shortening the high-frequency current path, reducing ESL, reducing circuit distortion, and maintaining the fidelity of the RF signal.