SBP696 chip/wafer ball placement machine
After automatic positioning based on image processing, flux is printed on the wafer and soldered balls are soldered to the corresponding positions of the 12-inch wafer. Chip installation, manual removal saves space, low-cost semi-automatic device.
After automatic positioning based on image processing, solder flux is printed on the wafer, and solder balls are soldered to the corresponding position of the 12-inch wafer. Chip installation, manual removal, space-saving, low-cost semi-automatic device.
Solder ball mounter for 12-inch wafers that print solder on the wafer after automatic positioning by image processing, and mount balls.
Wafers are set and taken out manually by a space-saving semi-automatic device. Mounting on boards is also supported.
features
Realized high-quality ball mounting without damaging the solder balls by the metal cup method
According to the correspondence of each wafer size of the wafer stage, it is most suitable for the use of high-variety low-volume production and research and development.
No extra ball generation on the mask, reducing the generation of discarded balls
- Parameters
After automatic positioning based on image processing, solder flux is printed on the wafer, and solder balls are soldered to the corresponding position of the 12-inch wafer. Chip installation, manual removal, space-saving, low-cost semi-automatic device.
Solder ball mounter for 12-inch wafers that print solder on the wafer after automatic positioning by image processing, and mount balls.
Wafers are set and taken out manually by a space-saving semi-automatic device. Mounting on boards is also supported.
features
Realized high-quality ball mounting without damaging the solder balls by the metal cup method
According to the correspondence of each wafer size of the wafer stage, it is most suitable for the use of high-variety low-volume production and research and development.
No extra ball generation on the mask, reducing the generation of discarded balls
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