SBP662 wafer Planting ball machine/BGA ball planting machine
High accuracy image positioning, unified loading of Flax printing and planting balls, using a unique microsphere specific cup that can correspond to Min 60 μ m.
High precision image positioning, uniformly loaded with Flax printing and planting balls, using a unique microsphere exclusive cup that can correspond to Min.60 μ M.
characteristic
Adopting a metal cup method developed for carrying microspheres
Through the ball recycling function, a significant reduction in the amount of waste balls has been achieved
Realize unique high-precision positioning balls
Stable ball loading is achieved through high-precision image positioning mechanism and chip thickness detection function.
Switch to positive, each big circle, each big circle
There are no extra balls on the mask, reducing the generation of waste balls
- Parameters
High precision image positioning, uniformly loaded with Flax printing and planting balls, using a unique microsphere exclusive cup that can correspond to Min.60 μ M.
characteristic
Adopting a metal cup method developed for carrying microspheres
Through the ball recycling function, a significant reduction in the amount of waste balls has been achieved
Realize unique high-precision positioning balls
Stable ball loading is achieved through high-precision image positioning mechanism and chip thickness detection function.
Switch to positive, each big circle, each big circle
There are no extra balls on the mask, reducing the generation of waste balls
| Model | SBP662 |
| Suitable for variety | wafer Wafer level CSP |
| Ball diameter | φ60-300µm |
| wafer size | 8inch&12inch（Optional 6inch） |
| processing capacity | 12inch：40WPH *Ф60um Ball 150万Ball |
| position accuracy | ±10µm |
| Machine dimensions | 5000(L)x3000(W)x2000(H)mm |
| Device quality | 3000kg |
Copy product links
Long by picture save/share
INQUIRY
Add Successfully
INQUIRY
Add Successfully
Tel：18018712764
E-mail：huangtz@tec-pho.com
Address：3rd Floor, Building B, No. 84 Xinyu Road, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province
About Us
· Company culture
· Honor
Product
· Probe station
· Chip testing machine
· Blue film braiding machine
· LED spectrophotometer
· More products
News
· Company News
· Industry News
Contact
· Online Message
Website registration：粤ICP备12034829号
Copyright© 2024 Tec Semiconductor Equipment (Shenzhen) Co., Ltd
点击右上角
分享给朋友吧
