BGA ball planting machineSBP550
After high accuracy image positioning, install the Min. diameter 0.06mm solder ball onto the substrate of the large substrate using microsphere mount. By using a unique metal cup method, the ball is loaded without damage and the microspheres are stable.
After high-precision image positioning, install the Min.p0.06mm solder ball onto a large substrate using microsphere mount. By using a unique metal cup method, the ball is loaded without damage and the microspheres are stable.
feature
Adopting a unique metal cup method developed for carrying microspheres
The recycling function of balls has significantly reduced the amount of waste balls
Stable ball loading is achieved through high-precision image positioning and substrate thickness detection functions
By reducing attachments, we can significantly reduce the time required for model changes
- Parameters
After high-precision image positioning, install the Min.p0.06mm solder ball onto a large substrate using microsphere mount. By using a unique metal cup method, the ball is loaded without damage and the microspheres are stable.
feature
Adopting a unique metal cup method developed for carrying microspheres
The recycling function of balls has significantly reduced the amount of waste balls
Stable ball loading is achieved through high-precision image positioning and substrate thickness detection functions
By reducing attachments, we can significantly reduce the time required for model changes
| Applicable varieties | Large substrate for micro convex lifting |
| Ball diameter | Min.φ0.06mm |
| Ball carrying range | Max. 250(W)×330(L)mm |
| Substrate size | Max. 260(W)×340(L)mm |
| accuracy | ±0.015mm (3σ) |
| size | 1300(L)×1245(W)×1700(H)mm |
| weight | 1200kg |
Previous : BGA ball planting machineSBM500
Next : SBP662 wafer Planting ball machine/BGA ball planting machine
Copy product links
Long by picture save/share
INQUIRY
Add Successfully
INQUIRY
Add Successfully
Tel：18018712764
E-mail：huangtz@tec-pho.com
Address：3rd Floor, Building B, No. 84 Xinyu Road, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province
About Us
· Company culture
· Honor
Product
· Probe station
· Chip testing machine
· Blue film braiding machine
· LED spectrophotometer
· More products
News
· Company News
· Industry News
Contact
· Online Message
Website registration：粤ICP备12034829号
Copyright© 2024 Tec Semiconductor Equipment (Shenzhen) Co., Ltd
点击右上角
分享给朋友吧
