BGA ball planting machineSBM500
Automatic positioning of image processing, flux transfer, batch loading of balls, and welding mountains for image processing inspection on BGA/CSP substrates.
After automatic alignment in image processing, solder balls can be installed in batches at high speed until the quality is determined through image inspection and can be automatically carried out.
characteristic
Carrying high-precision balls through image positioning
High speed achieved through dual channel substrate handling
By using a substrate handling table and substrate adsorption auxiliary mechanism, it can correspond to substrates with larger bends
- Parameters
Automatic positioning of image processing, flux transfer, batch loading of balls, and welding mountains for image processing inspection on BGA/CSP substrates.
After automatic alignment in image processing, solder balls can be installed in batches at high speed until the quality is determined through image inspection and can be automatically carried out.
characteristic
Carrying high-precision balls through image positioning
High speed achieved through dual channel substrate handling
By using a substrate handling table and substrate adsorption auxiliary mechanism, it can correspond to substrates with larger bends
| Model | SBM500 |
Suitable for variety | BGA、CSP (Assembly substrate) FCBGA、FCCSP (Solid substrate) |
| Ball diameter | φ0.15～0.76mm |
| Ball spacing | Min. 0.30mm |
| Ball carrying range | Max. 270(L)x90(W)mm |
| BGASubstrate size | Max. 280(L)x100(W)mm |
| accuracy | ±0.03mm (3σ) φ0.15mmボール時 |
| size | 2580(L)×1655(W)×1715(H)mm |
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