BGA ball planting machineSBM385
Inspect the assembly substrate containing microspheres, and inspect and repair the defective parts using a repair device.
At the same time, it also supports the industry's first dual ball inspection and repair
Inspect the assembly substrate containing microspheres, and inspect and repair the defective parts using a repair device.
At the same time, it also supports early dual ball inspection and repair in the industry
characteristic
Using a ball removal mechanism to repair double balls and extra balls
Min φ 0.06mm can inspect up to 3 million balls
Implementing parallel high-speed processing of inspection and repair processes through the use of a two-level structure
Internal connection can be achieved through connection with Microsphere Mountain
- Parameters
Inspect the assembly substrate containing microspheres, and inspect and repair the defective parts using a repair device.
At the same time, it also supports early dual ball inspection and repair in the industry
characteristic
Using a ball removal mechanism to repair double balls and extra balls
Min φ 0.06mm can inspect up to 3 million balls
Implementing parallel high-speed processing of inspection and repair processes through the use of a two-level structure
Internal connection can be achieved through connection with Microsphere Mountain
| Model | SBM385 |
| Suitable for variety | BGA、CSP、Large substrate、PLP |
| Ball diameter | Min.φ0.06mm |
| Inspection scope | Max. 250(W)×330(L)mm |
| Substrate size | Max. 260(W)×340(L)mm |
| size | 1400(L)×1300(W)×1800(H)mm |
| Device quality | 1200kg |
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