BGA ball planting machineSBM381
Inspect wafers containing microspheres and repair defective areas with inspection and repair devices.
It also supports the industry's first dual ball inspection and repair.
A device for inspecting and repairing defective areas on wafers containing microspheres.
At the same time, it also supports early dual ball inspection and repair in the industry.
characteristic
Using a ball removal mechanism to repair double balls and extra balls
Min φ 0.06mm can inspect up to 3 million balls
Implementing parallel high-speed processing of inspection and repair processes through the use of a two-level structure
Internal connection can be achieved through connection with Microsphere Mountain
By rechecking the defective parts before and after repair, a high yield was achieved
- Parameters
A device for inspecting and repairing defective areas on wafers containing microspheres.
At the same time, it also supports early dual ball inspection and repair in the industry.
characteristic
Using a ball removal mechanism to repair double balls and extra balls
Min φ 0.06mm can inspect up to 3 million balls
Implementing parallel high-speed processing of inspection and repair processes through the use of a two-level structure
Internal connection can be achieved through connection with Microsphere Mountain
By rechecking the defective parts before and after repair, a high yield was achieved
| Model | SBM381 |
Suitable for variety | wafer packing Chip level CSP Electronic components |
| Ball diameter | φ0.06～0.5mm |
| Inspection scope | φ12 |
| wafer size | φ4（Optional） |
| Device size | 1440(L)×1792(W)×1750(H)mm |
| Device quality | 1500kg |
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