BGA ball planting machineSBM371
After automatic alignment through image processing, solder balls are loaded in batches at high speed.
Small size, space saving, and good maintenance.
By connecting with the optional ball loading inspection system (SBI 371), a fully automatic loading inspection line can be constructed.
characteristic
Carrying high-precision balls through image positioning
Can support wide substrate (substrate width: Max.180mm)
The bending of the substrate adopts a strong flag rotation transfer printing method
Adopting a ball suspension adsorption method that is not easily damaged
Unified installation on solid substrates through carrier wave handling
- Parameters
After automatic alignment through image processing, solder balls are loaded in batches at high speed.
Small size, space saving, and good maintenance.
By connecting with the optional ball loading inspection system (SBI 371), a fully automatic loading inspection line can be constructed.
characteristic
Carrying high-precision balls through image positioning
Can support wide substrate (substrate width: Max.180mm)
The bending of the substrate adopts a strong flag rotation transfer printing method
Adopting a ball suspension adsorption method that is not easily damaged
Unified installation on solid substrates through carrier wave handling
| Model | SBM371 |
Suitable for variety | BGA、CSP (Assembly substrate) FCBGA、FCCSP (Solid substrate) |
| Ball diameter | φ0.15～0.76mm |
| Ball carrying range | Max. 90(W)x290(L)mm |
| BGASubstrate size | Max. 100(W)x300(L)mm |
| Ball Carrying accuracy | ±0.05mm (3σ) φ0.2mm |
| Device size | 1365(L)×1180(W)×1800(H)mm |
| Device quality | 1200kg |
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