BGA ball planting machineSBM280
By installing a ball on each wafer and bottom plate, it can be arranged freely, making it a suitable handheld ball mountain for experiments and trials.
By installing a ball on each wafer and substrate, it can be arranged freely, making it a suitable handheld ball mount for experiments and trials.
characteristic
Programmatic 1 ball loading function, no need to replace accessories when changing ball layout
The transcription system produced in bulk is as easy as the transcription system
It can also be used as a repair machine for mass production systems
- Parameters
By installing a ball on each wafer and substrate, it can be arranged freely, making it a suitable handheld ball mount for experiments and trials.
characteristic
Programmatic 1 ball loading function, no need to replace accessories when changing ball layout
The transcription system produced in bulk is as easy as the transcription system
It can also be used as a repair machine for mass production systems
| Model | SBM280 |
Suitable for variety | BGA、CSP (Assembly substrate) FCBGA、FCCSP (Solid substrate) Chip levelCSP |
| Ball diameter | φ0.2～1.0mm |
| Ball carrying range | Max.φ8inch |
| Substrate wafer size | Max.φ8inch |
| Beat time | 0.8Seconds / ball |
| Ball Carrying accuracy | ±0.025mm(3σ) |
| Device size | 1060(L)x800(W)x1680(H)mm |
| Device quality | 350kg |
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