BGA ball planting machineSBM101
Automatically perform flux transfer and ball loading on manually supplied BGA substrates, corresponding to small-scale and space saving mobile ball mountains from trial production to mass production.
Automatically perform flux transfer and ball loading on manually supplied BGA substrates, corresponding to small-scale and space saving mobile ball mountains from trial production to mass production.
characteristic
In order to implement automatic flux transfer and ball loading, it can be widely used in trial production, development, and small-scale production
Solder flux transfer printing adopts a pin transfer printing method that is resistant to substrate bending
Adopting a ball suspension method that is not easily damaged
Through image monitoring function, easy position adjustment can be made
No need for tools to replace accessories, easy to change variety
Standard error detection function equipped with various sensors
- Parameters
Automatically perform flux transfer and ball loading on manually supplied BGA substrates, corresponding to small-scale and space saving mobile ball mountains from trial production to mass production.
characteristic
In order to implement automatic flux transfer and ball loading, it can be widely used in trial production, development, and small-scale production
Solder flux transfer printing adopts a pin transfer printing method that is resistant to substrate bending
Adopting a ball suspension method that is not easily damaged
Through image monitoring function, easy position adjustment can be made
No need for tools to replace accessories, easy to change variety
Standard error detection function equipped with various sensors
| Model | SBM101 |
Suitable for variety | BGA、CSP (Assembly substrate) FCBGA、FCCSP (Solid substrate) |
| Ball diameter | φ0.2～1.0mm |
| Ball carrying range | Max. 50x80mm/mount |
| Substrate size | Max. 100(W)x230(L)mm |
| Beat time | 12Seconds/installation |
| Ball Carrying accuracy | ±0.1mm (3σ) |
| Device size | 1000(L)x810(W)x1700(H)mm |
| Device quality | 500kg |
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