EMC bracket precautions

(1) The method of using L/F can only be used on both sides - using it in the middle will contaminate the electroplating layer,

(2) The partition paper cannot be removed - without the protection of the partition paper, friction will cause the EMC surface of the L/F to turn black,

(3)  When taking or moving L/F, do not apply force - L/F will deform and crack the cup under force,

(4) Before use, it is necessary to blow air first - if there is no blowing air specifically for the reflective cup, the silica material of EMC will fall into the functional area, causing floating crystals

(5) Plasma cleaning should be done before soldering and wire production - failure to clean may result in insufficient pulling force (or proportional yield issues)

(6) Customers must decide on their own to use Silicone that has good adhesion with EMC adhesive and electroplated silver layer, and cannot directly use the original Silicone

(7) Due to the characteristics of EMC materials, delivered products may occasionally produce "cracks" on the colloid. These "cracks" are a natural phenomenon of shrinkage after injection. When these small cracks occur at a depth of less than half of the depth of the reflection cup top, at a depth of less than half of the reflection cup wall penetrating the EMC body, or at a depth of less than the insulation trench penetrating the tin surface, they must be considered acceptable levels.