FLIP CHIP eutectic machineSDM200C
Install chips on the image sensor packaging, install steel wire rings, install glass covers, and store the fully automatic continuous line of the tray. Composed of resin coating department, glass loading department, inspection, hardening furnace, and storage department
Install chips on the image sensor packaging, install steel wire rings, install glass covers, and store the fully automatic continuous line of the tray. Composed of resin coating department, glass loading department, inspection, hardening furnace, and storage department
characteristic
Support cleanliness level below 100
Consistent assembly process line for CCD/COMS image sensors
Apply high-speed resin with both ends
Image inspection function with resin coating status
- Parameters
Install chips on the image sensor packaging, install steel wire rings, install glass covers, and store the fully automatic continuous line of the tray. Composed of resin coating department, glass loading department, inspection, hardening furnace, and storage department
characteristic
Support cleanliness level below 100
Consistent assembly process line for CCD/COMS image sensors
Apply high-speed resin with both ends
Image inspection function with resin coating status
| Model | SDM200C |
| Adapt to variety | CMOS image sensor/CCD |
| Package size | Max.□１４．５㎜ ｔ１．０㎜ |
| Packaging supply method | Specialized carrier Max.２２０×２６㎜ ｔ１．１㎜ |
| Chip size | ３～８㎜ ｔ０．2～０．６５㎜ |
| Chip supply mode | φ8 Inch crystal ring |
| Glass size | ３～１４㎜ ｔ０．３㎜～ |
| Glass supply method | Special tray |
| Finished product storage | JEDEC tray |
| Glass joint method | UV bonding |
Joining load | chip：０．５～５．０Ｎ glass：０．５～２．０Ｎ |
| Carrying accuracy | chip：±20µm (3σ)、glass：±10µm (3σ) |
| Line size | 8710㎜×1400㎜×1800㎜ |
| line weight | 7450kg(Remove the weight of the welding wire machine） |
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