FLIP CHIP eutectic machineFUB300
对应Chip On Wafer的高accuracy发动机。
支持洁净度等级100以下的产品，最适合安装图像传感器的玻璃芯片等。
The high-precision engine corresponding to Chip On Wafer.
Supporting products with a cleanliness level below 100, it is very suitable for installing glass chips for image sensors, etc.
characteristic
Cleanliness class below 100 degrees Celsius
High precision welding achieved through image processing and linear ruler
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
- Parameters
The high-precision engine corresponding to Chip On Wafer.
Supporting products with a cleanliness level below 100, it is very suitable for installing glass chips for image sensors, etc.
characteristic
Cleanliness class below 100 degrees Celsius
High precision welding achieved through image processing and linear ruler
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
| Adapt to the model | CMOS sensor |
| Substrate size | φ6、φ8inch（Optional accessories：φ12inch） |
| Chip supply mode | tray（φ2、φ4inch），Can support dedicated pallets |
| Chip heating method | Max. 450℃ |
| Substrate heating method | Max. 450℃ |
| load | 1～30N |
| accuracy | ±10µm |
| Device size | 2300(L)×1900(W)×1910(H)mm |
| Device quality | 1400kg |
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Address：3rd Floor, Building B, No. 84 Xinyu Road, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province
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