FLIP CHIP eutectic machineFUB281
High speed and high accuracy connectors for optical communication modules/devices corresponding to Assembly substrate.
Can flexibly respond to various implementation methods and diverse supply forms, supporting options.
characteristic
High precision joint
Face down mode (when identifying the installation surface) ± 2 µ m (3 σ)
Face up mode (when recognizing top) ± 3 µ m (3 σ) * High precision mode
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
High productivity has been achieved through a dual stage structure that simultaneously handles resin transfer printing and chip installation
Support chip processing
Multi variety supply of chips
- Parameters
characteristic
High precision joint
Face down mode (when identifying the installation surface) ± 2 µ m (3 σ)
Face up mode (when recognizing top) ± 3 µ m (3 σ) * High precision mode
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
High productivity has been achieved through a dual stage structure that simultaneously handles resin transfer printing and chip installation
Support chip processing
Multi variety supply of chips
| Model | FUB281 |
| Suitable for variety | VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/Analog device/LED/etc |
| Substrate size | Max. 100×150mm |
| Chip size | □0.25mm～□5.0mm |
| Chip supply mode | Grip ring / Gelpack tray |
| Joining load | 0.05～5.0N |
| Carrying accuracy | ±2µm (3σ) Face down mode/ ±3µm (3σ) Face Up mode |
| Device size | 2840(W)X1940(D)X1700(H)mm |
| Device quality | 3000kg |
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Tel：18018712764
E-mail：huangtz@tec-pho.com
Address：3rd Floor, Building B, No. 84 Xinyu Road, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province
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