FLIP CHIP eutectic machineFDB210 FDB211
Mainly used for hot pressing eutectic machines for flip chip fabrication, can be used for eutectic of IC, optical communication devices, and laser devices
feature
High precision welding ± 2 µ m (3 σ)
Support microchip processing
Eliminating position changes over time through an automatic calibration mechanism to ensure stable accuracy
By parameterizing sequential control, it is easy to program and control the load, temperature, and various timings
Support high-precision load control based on load feedback method
Starting with eutectic bonding, various construction methods can be easily handled through rich option settings
- Parameters
feature
High precision welding ± 2 µ m (3 σ)
Support microchip processing
Eliminating position changes over time through an automatic calibration mechanism to ensure stable accuracy
By parameterizing sequential control, it is easy to program and control the load, temperature, and various timings
Support high-precision load control based on load feedback method
Starting with eutectic bonding, various construction methods can be easily handled through rich option settings
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Tel：18018712764
E-mail：huangtz@tec-pho.com
Address：3rd Floor, Building B, No. 84 Xinyu Road, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province
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