FLIP CHIP eutectic machineFDB350
The corresponding high-precision button.
The heater used for heating is equipped with a newly developed laser heater.
Compared to previous heaters, it can achieve high-speed heating and cooling.
characteristic
Using laser heaters to achieve high-speed heating and cooling.
The temperature deformation of the heater is very small, and high-precision gap control can be carried out during connection
High precision welding ± 2 μ M (3 σ）
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
- Parameters
The corresponding high-precision button.
The heater used for heating is equipped with a newly developed laser heater.
Compared to previous heaters, it can achieve high-speed heating and cooling.
characteristic
Using laser heaters to achieve high-speed heating and cooling.
The temperature deformation of the heater is very small, and high-precision gap control can be carried out during connection
High precision welding ± 2 μ M (3 σ）
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
| Model | FDB350 |
| Suitable for variety | Memory / logic / analog device /TSV chip |
| Substrate size | Max.12inchwafer |
| Chip supply mode | Max.12inchwafer |
| Chip heating method | Laser heating |
| Substrate heating method | Continuous heat |
| Joining load | 1～100N |
| Carrying accuracy | ±2µm (3σ) |
| Device size | 2690(W)X1990(D)X2000(H)mm （Excluding the substrate wafer supply department） |
| Device quality | 2200kg |
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