FLIP CHIP eutectic machineFDB250
High precision engine that supports COB (Chip on Board).
Install LASER heater on the heating heater.
Compared to previous heaters, it can perform high-speed heating and cooling.
characteristic
Using laser heaters to achieve high-speed heating and cooling.
The temperature deformation of the heater is very small, and high-precision gap control can be carried out during connection
High precision welding ± 2 μ M (3 σ）
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
- Parameters
High precision engine that supports COB (Chip on Board).
Install LASER heater on the heating heater.
Compared to previous heaters, it can perform high-speed heating and cooling.
characteristic
Using laser heaters to achieve high-speed heating and cooling.
The temperature deformation of the heater is very small, and high-precision gap control can be carried out during connection
High precision welding ± 2 μ M (3 σ）
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
| Model | FDB250 |
| Suitable for variety | Memory / logic / analog device /TSV chip |
| Substrate size | Max.240mmX100mm |
| Chip size | Max. □12mm |
| Chip supply mode | Max.12inchwafer |
| Chip heating method | Laser heating |
| Substrate heating method | Continuous heat |
| Joining load | 1~100N |
| Carrying accuracy | ±2µm (3σ) |
| Device size | 1985(W)X2470(D)X1950(H)mm（Excluding substrate loaders） |
| Device quality | 2000kg |
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