Ultra high accuracy connectors for optical communication modules/optical equipment.
The accuracy of ± 0.8 μ m (3 σ) was achieved through a high accuracy positioning mechanism.
Ultra high precision connectors for optical communication modules/optical equipment.
± 0.8 achieved through high-precision positioning mechanism μ The accuracy of m (3o).
characteristic
Ultra high precision welding ± 0.8 μ M (3 σ)
Small size, space saving
Support microchip processing
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
Through parameter sequence control, it is easy to program and control the load, temperature, and various timings
High precision load control corresponding to load feedback mode
Corresponding to installation in low oxygen concentration atmosphere
Ultra high precision connectors for optical communication modules/optical equipment.
± 0.8 achieved through high-precision positioning mechanism μ The accuracy of m (3o).
characteristic
Ultra high precision welding ± 0.8 μ M (3 σ)
Small size, space saving
Support microchip processing
Cancel time and position changes through automatic calibration mechanism to stabilize accuracy
Through parameter sequence control, it is easy to program and control the load, temperature, and various timings
High precision load control corresponding to load feedback mode
Corresponding to installation in low oxygen concentration atmosphere
| Model | FDB210P |
| Suitable for variety | VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/LIDAR/etc |
| Carrying accuracy | ±0.8µm(3σ) |
| Substrate size | □0.4mm~10.0mm |
| Chip size | □0.25mm~6.0mm |
| Chip substrate supply method | Pallet supply、Put the wristband on |
| Chip heating method | Pulse heater(Max.450°C) |
| Substrate heating method | Pulse heater(Max.450°C) |
| Joining load | 0.1-5N |
| Device size | 2000(W)X1400(D)X1700(H)mm |
| Device quality | 2500kg(Host only) |

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