Recently, ASML, Samsung, Intel, Rapidus and other large manufacturers have new developments, ASML 2 nano research and development progress accelerated, is expected to be finalized in May this year; Samsung's AI chip production, its first generation of Warboy chip has been mass-produced, the second generation of chips or will be launched in the first half of next year; OPPO's first mobile processor expected in 2024; Intel's new integrated circuit company in Sanya, Hainan; Japan will add $2.3 billion in subsidies to Rapidus chip factory.
ASML advances 2 nm research and development
According to Taiwan media reports, semiconductor equipment manufacturer ASML will invest heavily in Taiwan, planning to build a new factory in Linkou Industrial Park, New Taipei City, to promote 2 nanometer research and development.Last year, ASML announced an expansion of its investment in Taiwan, with the first phase expected to amount to NT $30 billion and involve about 2,000 employees.According to the report, ASML's optical mask transmission module was moved to Taiwan, China, making Taiwan, China, the only manufacturing base in the world for ASML DUV optical mask transmission module, driving the growth of supply chain manufacturers such as Fan Xuan, Gongjun and Shenyong.Samsung has already mass-produced the first-generation Warboy NPU chip
According to foreign media news, Samsung's wafer foundry business unit has recently begun to use the 14nm process process to foundry the first generation of Warboy chips for FuriosaAI, a South Korean fabless manufacturer focused on artificial intelligence. In addition, the second-generation Warboy will also be manufactured by Samsung in the first half of next year using a 5nm process. The chip is said to process ten times faster than a GPU, but the price and power consumption is one-fifth that of a GPU.
ChatGPT boom has led to a sharp rise in the AI chip market, and the development of AI has also promoted the development of the semiconductor field. Samsung currently accepts fewer fabless orders, but the company is very optimistic about the prospects of the AI chip field, and it is also focused on increasing its AI chip production capacity by significantly increasing investment in infrastructure construction.According to public data, Samsung's P4 production line is under construction in Pyeongtaek, South Korea, with the goal of starting operation early next year. By 2042, it will spend 300 trillion won ($228 billion) to build the world's largest semiconductor cluster in Yeongnyong, Gyeonggi Province, South Korea. The company's Tyler City plant in Texas, which will mass-produce 4nm chips, is also under construction and will be operational in 2024.OPPO's first mobile processor is expected to debut in 2024
According to foreign media news, Chinese smartphone manufacturer OPPO has successfully developed a mobile processor prototype for smartphones, which is expected to be officially unveiled in 2024.OPPO's first self-developed mobile processor will be based on TSMC's 4nm process, with an 8-core CPU and a 1+3+4 three-cluster design, which may be a Cortex-X2 super-core, three Cortex-A710 and four Cortex-A510. At the same time, it also has 10 core GPU and a new generation of MariSiliconNPU developed by OPPO.In terms of performance, the report said that OPPO's smartphone processor is expected to catch up with Qualcomm's Snapdragon 8+ Gen 1. In terms of communication baseband, OPPO may attach 5G baseband chips from third parties, or choose from Qualcomm, Mediatek, Unigungri and Samsung.Intel New company settled in Sanya, Hainan
According to the official wechat public account of Hainan Commerce, on April 9, the opening ceremony of Intel Sanya office was successfully held in the Central business district of Sanya. At the same time, Intel's Hainan business will also start operations simultaneously.Earlier, Intel has been registered in Sanya, Hainan Intel Integrated Circuit (Hainan) Co., LTD. It is reported that the newly established Intel Integrated Circuit (Hainan) Co., LTD., as a wholly-owned subsidiary of Intel in Hainan Free Trade Port, will provide cross-border hardware and software product distribution and settlement, software design and licensing, system integration, talent training and other related services for the Chinese market, while engaging in equity investment activities for domestic start-ups.With Intel officially settled in Hainan, it will attract more domestic and foreign digital economy head enterprises to lay out in Hainan, accelerate the formation of industrial agglomeration development, and help the construction of Hainan free Trade Port.Japan will give Rapidus an additional $2.3 billion in subsidies
Japan's Ministry of Economy, Trade and Industry is finalizing a plan to provide state-backed chipmaker Rapidus with an additional 300 billion yen ($2.27 billion) to build a semiconductor plant in Hokkaido, expected to be launched in 2025, according to Japanese media.Japan will increase financial support for chipmaker Rapidus as the company works to develop cutting-edge semiconductors, and domestic production of such components is crucial for Japan to excel in artificial intelligence and autonomous driving.According to public information, Rapidus is a joint venture jointly invested by eight technology companies including SONY Group and NEC in Tokyo last year, with the goal of manufacturing high-end 2-nanometer chips in Japan by 2025. Japan has previously said it would invest 70 billion yen (about $525 million) in Rapidus. the program is coordinated by the Leading-edge Semiconductor Technology Center (LSTC), through which Japan will invest $34.7 billion in Rapidus over 10 years.At the end of February this year, it was reported that Rapidus President Junichi Koike said after meeting with Hokkaido Governor Naichi Suzuki that Rapidus has finalized its plan to build a factory in Hokkaido, and the candidate site is expected to be the industrial park in Chitose City, Hokkaido. In addition, he said that with the support of US chip giant IBM, it needs about 7 trillion yen to start mass production of advanced logic chips around 2027.
Source: Semiconductor Today
(The above article is reprinted, if there are copyright and other issues, please contact us to deal with)
Tel：18018712764
E-mail：huangtz@tec-pho.com
Address：3rd Floor, Building B, No. 84 Xinyu Road, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province
