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Technology and application of chip eutectic machine

Time: 2023-04-03 09:39:19

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FDB210 and FDB211 chip eutectic machines are mainly used for hot pressing eutectic machines for inverted chips, and can be used for eutectic in IC, optical communication devices, laser devices, etc. It is a dual-purpose optical device packaging and flip chip mounting machine with ultra-high precision welding and production.

FDB210 and FDB211 chip eutectic machines are mainly used for hot pressing eutectic machines for inverted chips, and can be used for eutectic in IC, optical communication devices, laser devices, etc. It is a dual-purpose optical device packaging and flip chip mounting machine with ultra-high precision welding and production.

                                                                                                                               FDB210, FDB211 chip eutectic machine

It mainly has the following functional characteristics

High precision welding: enhances the rigidity of the equipment rack and the impact of vibration on the equipment, achieving ± 0.8 in FACEDOWN mode μ M (3 σ), ± 3 in FACEUP mode μ M (3 σ) High precision automatic welding and efficient production. There is also an automatic calibration function to ensure stable high-precision welding.

                                                                      

                                                                                              Welding unit

Most suitable for eutectic welding: use a high-speed pulse heater to make the process of multi chip welding easier. In addition, the welding station is filled with protective gas to ensure stable welding quality.

                                                              

                                                                                 Chip Supply Department

Stable transmission system: With built-in buffer function, the transmission process is more stable, greatly reducing damage to the chip.


                                                               

                                                                              Automatic nozzle exchange mechanism

There are more functional configurations to choose from: multi chip correspondence, resin coating mechanism, dispensing, N2 protection mechanism, expansion ring correspondence, Wafer Map correspondence, various monitoring mechanisms and other accessories.



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