A variety of loading methods, manual loading and unloading, automatic loading and unloading, through the loading and unloading robot to carry out multi-parallel loading and unloading design;
Inverted integrated design, one machine can be compatible with the test of formal chip and flip chip;
Prober&Tester integrated machine design, with industry-leading test speed and accuracy;
High precision screw guide, stable quality, less wear, strong mechanical rigidity, smooth operation;
The size of the mechanism is optimized and reduced to improve the utilization rate of the plant;
Electrical measurement & optical measurement integrated testing with extremely high static and dynamic accuracy:
The self-developed real scale active electrode edge finder can effectively control the contact force between the probe and the chip electrode during each test to ensure the consistency of needle marks;
Self-flip light receiving structure, with higher optical sensitivity and accuracy, suitable for max-6inch Mini-LED chip, conventional flip chip, CSP chip test, formal chip, etc.
Multi-level filters are configured for different brightness chip test requirements.
A variety of loading methods, manual loading and unloading, automatic loading and unloading, through the loading and unloading robot to carry out multi-parallel loading and unloading design;
Inverted integrated design, one machine can be compatible with the test of formal chip and flip chip;
Prober&Tester integrated machine design, with industry-leading test speed and accuracy;
High precision screw guide, stable quality, less wear, strong mechanical rigidity, smooth operation;
The size of the mechanism is optimized and reduced to improve the utilization rate of the plant;
Electrical measurement & optical measurement integrated testing with extremely high static and dynamic accuracy:
The self-developed real scale active electrode edge finder can effectively control the contact force between the probe and the chip electrode during each test to ensure the consistency of needle marks;
Self-flip light receiving structure, with higher optical sensitivity and accuracy, suitable for max-6inch Mini-LED chip, conventional flip chip, CSP chip test, formal chip, etc.
Multi-level filters are configured for different brightness chip test requirements.



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