Suitable for 6 inch, 8 inch, 12 inch wafers, including SIC diode, transistor, mosfet, vertical structure chip measurement;
Multi-pin design can realize the requirement of multi-pin measurement at the same time, and improve the testing capacity of the machine;
With automatic needle cleaning, automatic needle grinding function;
The machine is equipped with a 10x lens for needle alignment, which can detect whether the needle tip of the probe card is offset by regular scanning to ensure stable production.
Built-in GPIB, RS232, TTL and other open interfaces, can be used with various chip testers in the market;
The chuck surface is gold-plated (can be nickel-plated) and is compatible with 6, 8, and 12-inch wafer vacuums
Suitable for 6 inch, 8 inch, 12 inch wafers, including SIC diode, transistor, mosfet, vertical structure chip measurement;
Multi-pin design can realize the requirement of multi-pin measurement at the same time, and improve the testing capacity of the machine;
With automatic needle cleaning, automatic needle grinding function;
The machine is equipped with a 10x lens for needle alignment, which can detect whether the needle tip of the probe card is offset by regular scanning to ensure stable production.
Built-in GPIB, RS232, TTL and other open interfaces, can be used with various chip testers in the market;
The chuck surface is gold-plated (can be nickel-plated) and is compatible with 6, 8, and 12-inch wafer vacuums


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